Following last year's Helio G90, MediaTek has just taken the wraps off two new smartphone chipsets for mobile gaming: the Helio G70 and G80. These chips are destined to hit India as soon as this month, with plenty of gaming-optimized specs for more affordably-priced gaming phones.
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Qualcomm might be leading the charge towards 5G with new chipsets for premium and "Premium B" phones this year. But in many parts of the world where the transition from 4G will be especially slow to start, the chipmaker will also need to cater to people set to stick with LTE for the next while. It's at this juncture that the company introduces the Snapdragon 460, 662, and 720G SoCs.
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Today MediaTek has formally revealed its latest mobile chipset, which packs an integrated 5G modem, 8-core design, and Wi-Fi 6 support, kicking off an all new "Dimensity" family of silicon. On paper, the latest Dimensity 1000 sounds like the first 5G-integrated chip MediaTek announced back in May of this year. But whether this is a rehash of that or not, there is one big twist this time around: MediaTek tells us we'll see phones running this new SoC land here in the USA.
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If you take a look at how gaming smartphones are comprised, you'll find that the OEM usually draws from off-the-shelf components and augments them with software or extra hardware, like thermal coolants, to juice up performance. When it comes to SoCs, most chipmakers have come to integrate new features into their products in pushing for a strident gaming experience, but MediaTek has decided to christen a new line of chipsets for devices dedicated to the grind.
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According to a report by WinFuture, Qualcomm is planning another new chipset for Wear OS devices, even though the existing Wear 3100 has barely materialized in any devices. The upcoming silicon will feature 64-bit support, 12nm node, Cortex A53 CPU cores, and is alleged to go by one of two potential names: "Snapdragon Wear 429" or "Snapdragon Wear 2700". In short, it sounds like it might actually bring some decent performance to the platform.
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Qualcomm's Snapdragon 700 series sits in an odd place in the market, one we don't really see in the US. The not-quite-flagship SoCs don't have quite the oomph the 800 series does, but the differences are strong enough to pull it away from the more mid-range 600 series. The newly announced Snapdragon 712 has an interesting, in-between state itself: On paper, it's essentially a Snapdragon 710 with clock bump.
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Qualcomm is undeniably the darling of Android OEMs, with their chips being the only viable option for flagship smartphones and tablets. That's something MediaTek would obviously like to change with its latest premium SoC, the Helio P90.
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MediaTek has just revealed its new Helio P70 SoC, the successor to the Helio P60, which was announced earlier this year. The marketing focus this time around is on improved AI-related operations, subsequently improved camera performance, and a better gaming experience. And, of course, it wouldn't be a chipset announcement if we weren't guaranteed power efficiency improvements. But on paper, the P70 sounds almost identical to the P60.
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At IFA, Huawei announced its new flagship system-on-chip, the Kirin 980. Following in the footsteps of its fantastic predecessor, the 980 is the first commerical 7nm SoC, meaning that Huawei beat Qualcomm to the punch. It uses a combination of modified Cortex-A76 and A55 cores, a new Mali-G76 GPU, and a dual Neural Processing Unit (NPU).
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Not only are chipset makers racing to 5G, there's also a constant push towards shrinking fabrication processes. The smaller the process, the smaller and more power efficient a chip can be – or, conversely, the more transistors it can fit, making it more powerful at the same size. As it stands, 10nm is as little as it gets when it comes to commercially available mobile processors, but that won't hold true for long. Shortly after Huawei quietly announced that its Kirin 980 system-on-a-chip (SoC) will be built on 7nm process technology, Qualcomm has announced that its next flagship chipset will also be built on the 7nm process node.
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